Samsung announced that it has developed the world's highest-density 16-gigabyte MCP (Multi-chip Package) solution by stacking 16 8-gigabit NAND flash chips in one package. The new package is 30% smaller in size than the previous 10-chip MCP due to the introduction of new wafer-thinning, laser-cutting, and redistribution layer technologies. Samsung's new MCP solution is expected to meet increasing demand for multimedia functions in slimmer consumer electronics.